Liquid Photoimageable Soldermask for High Reliability Automotive Applications
With the shift of the production of PCBs for high reliability automotive electronics from Europe to Asia OEMs struggled to receive PCBs with the same reliability performance as they were used from European manufacturers. This is caused by the different chemistry of the soldermask systems used by major manufacturers in Europe and in Asia. This paper will explain the differences in the soldermask chemistry and their effects on the thermal reliability further in details.
Carsten Schauer
Atotech Berlin Germany
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）