Evaluation of Pb-free BGA Solder Joint Reliability on Nickel-based Surface Finishes using Alternative Solder Ball Shear Speeds
This technical paper summarizes the findings and conclusions from a comprehensive examination of Pb-free solder ball bonding, comparing ball shear testing results. The paper compares results obtained from conventional (slow) speed ball shear testing with the results from newer high-speed test parameters. Findings are also compared for two different PWB surface finishes: a process-of-record electroless nickel / immersion gold finish (ENIG), and an electroless nickel / electroless palladium / immersion gold finish (Ni/Pd/Au). Testing variables include surface finish deposit thickness, solder ball diameter, resist opening and ball shear speed. Test results are presented as graphical representations of ball shear forces and graphical representations of fracture modes. Analyses of results include determinations of the fracture modes for the various test methods and deposit conditions. Conclusions are offered regarding the test method and parameters, the performance of the two surface finishes and their interaction within Pb-free applications.
Sven Lamprecht Hugh Roberts Shozo Nishida Mustafa (O)zk(o)k Kuldip Johal
Atotech Deutschland GmbH,Berlin,Germany;Atotech USA Inc.,Rock Hill,SC,USA;Atotech Japan K.K.,Yokohama,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）