UV-Laser for Fast and Stress-Free Cutting of Flexible Circuits
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Todays electronic devices require higher density and tighter tolerances due to the ever increasing demand of miniaturization and function integration (smaller-faster –lighter-cheaper). Flex and rigid-flex printed circuit boards are increasingly used offering the ability to resolve three dimensional structural issues and high density electrical interconnection. Flexible materials are extremely difficult to handle in manufacturing. Mechanical stress placed on the materials by mechanical routing or punching equipment is disadvantageous with regard to accuracy, burr formation and reliability.LPKF has developed and qualified laser technology based on a UV laser source with a fast scanner system meeting these challenges. Non-contact processing with a laser means no mechanical stress on the flex board or its components, no burr or debris and no extra costs for tooling. Smallest tool size of a focussed laser beam is equivalent to highest precision allowing for component placement closer to the edges of a board and increasing the net usable area on a panel.The presentation introduces a laser-based cutting process for the singulation of flex and flex-rigid circuits including coverlayer material Todays market, existing solutions and customer requirements are described. Taking into account the limitations of conventional singulation methods as well as current and future requirements the advantages of using a laser-based singulation are discussed. The laser processes, the equipment used as well as cutting results and examples are presented in detail.
Dieter J.Meier Marc Hueske Nils Heininger Harald Knechtel
LPKF Laser & Electronics AG Garbsen,Germany;LPKF Laser & Electronics AG (Asia Ltd.)Hong Kong
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）