High Performance Resin Systems for Copper Clad Laminates
The banning of lead in solders has implication on the processing condition under which components are mounted. The printed wire board shop’s need to choose materials that withstand the higher soldering temperatures of lead free alloys. Recent advances in epoxy technology have been leading to a series of new products that enable higher processing temperature. These materials are normally phenolic cured and will also lead to higher CAF resistance.The paper will discuss how to ensure a higher thermal reliability without affecting other processing considerations. The implications of the flame retardant selection on the final board performance will be demonstrated. The thermal stability data of various epoxy systems will be described and correlated to specific application needs. Other binder properties such as toughness and adhesion will be discussed. These properties are playing a major role if additional inorganic material is used in the epoxy resin matrix such as fillers. Pro’s and con’s of filler usage is shown and thermal stress build up in package is analyzed Results are pointing towards the use of new building blocks that impart higher thermal resistance combined with excellent processing characteristics. These new building blocks are applied in printed wire board application but may also be applied in other polymer application for electronic industry that requires higher heat stability such as IC-Substrates.
B.Hoevel J.Gan
Dow Anlagengesellschaft mbH
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）