Laser Direct Testing a Step Forward for the Electrical Test of IC Package Substrates (FC-BGA, SiP, …)

摘要：

As interconnection density of PWB’s keeps on rising, so does the cost of advanced electrical test. Today, investing in a new test capacity has become one of the most strategic decisions for a High End PCB manufacturer, and even more challenging for the Semiconductor Packaging substrates segment, with the spread of Flip Chip (FC-BGA) and System in Package (SiP) applications.

作者: Christophe Vaucher

作者单位: Beamind Bandol,France

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）