Innovative Final Nanofinish for PCBs with the Organic Metal
For the first time, a thin layer of only a few nanometres has been deposited onto copper pads of printed circuit boards which provides effective protection against oxidation and preserves its solderability. The nano layer has a thickness of nominally only 50 nm, and contains the Organic Metal (conductive polymer) and a small amount of silver. With > 90％ (by volume), the Organic Metal is the major component of the deposited layer, Ag is present equivalent to a thickness of 4 nm. This Organic Metal – Ag complex final finish outperforms any established surface finishes.
B.Wessling M.Thun C.Arribas-Sanchez S.Gleeson J.Posdorfer M.Rischka B.Zeysing N.Arendt
Ferdinand-Harten-Str.7 D-22949 Ammersbek Germany
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）