会议专题

Packaging and Thermal Characteristics of Epi-down bonded Uncooled Pump Lasers

High-power single-mode 980nm pump lasers are the key components in optical fiber amplifier. Thermal management for the telecom applications is a key design parameter for both package and system level. In this paper, based on the designed structural and material parameters of Epi-down bonded uncooled 980nm laser, the heat distribution of Epidown bonded uncooled pump laser was simulated using the finite element method, and the photoelectric properties of designed and packaged module were tested. A fiber output power of 200mW was achieved for the Epi-down bonded uncooled 980nm laser with fiber Bragg grating, and module can work steadily over a wide temperature range of 0~70℃ , with a small wavelength shift of 0.2nm, along with a FWHM less than 1.1nm, and a SMSR of more than 45dB.

980nm pump laser Epi-down bonding thermal characteristics finite element method

Bin Wu Yi Li Shuangshuang Hu Qunjie Jiang Xiaojing Yu Haifang Wang

College of Optical and Electronic Information Engineering, University of Shanghai for Science andTec College of Optical and Electronic Information Engineering,University of Shanghai for Science andTech College of Optical and Electronic Information Engineering,University of Shanghai for Science andTech College of Optical and Electronic Information Engineering,University of Shanghai for Science and Tec

国际会议

2008亚太光通信会议(Asia-Pacific Optical Communications 2008)

杭州

英文

2008-10-26(万方平台首次上网日期,不代表论文的发表时间)