会议专题

Ka band Spatial Power-Combining Amplifier Structures

2.24 w power-amplifier (PA) module at 35 GHz presented using broad-band spatial power-combining system. The combiner can accommodate more monolithic microwave integrated-circuit (MMIC) PA with stagger placement structure on limited microstrip space in ka-band waveguide structure with good return losses, and heat can dissipated into aluminum carrier quickly. This combiner is based on a slotline-tomicrostrip transition structure, which also serves as a four-way power combiner. The proposed 2*2 combining structure combined by vertical stacking inside the waveguide was analyzed and optimized by finite-element-method (FEM) simulations and experiments.

slotline- to-microstrip Tapered-slot antenna

An Dawei Lv Xin

Lab.MCES.Beijing Institute of Technology Beijing,CHINA Lab.MCES.Beijing Institute of Technology,Beijing,CHINA

国际会议

The 11th IEEE International Conference on Communications Systems(第11届电子和电气工程师协会国际通信系统会议)(IEEE ICCS 2008)

广州

英文

2008-11-19(万方平台首次上网日期,不代表论文的发表时间)