A Wafer-Scale Packaging for RF DMTL Phase Shifter
In this paper,a wafer-scale gold-to-gold thermocompressionbonding packaging based on an RF distributedMEMS transmission line (DMTL) phase shifter is proposed.The DMTL phase shifter,based on a coplanar waveguide(CPW),has symmetrical saw-shaped structures in the CPWsignal line under the MEMS bridge and an insulation layer inthe middle of the structures.Two Si wafers are bonded togetherusing gold-to-gold thermo-compression bonging with one asthe cap wafer and the other as the substrate wafer whichembodies RF DMTL phase shifter.A CST software is used forthe modeling,simulation and optimization from 30 to 40GHz.Results show that the proposed design,with a 35GHz centralresonant frequency,has a return loss less than -10dB within2.4GHz bandwidth range and for each RF MEMS switch-typebridge,as high as 60 degrees phase shift is realized.Comparedwith the naked MEMS phase shifters,the return loss can beimproved by 3dB,and the performance of phase shift remainsalmost the same.
DMTL phase shifter thermo-compression bonding wafer-scale packaging saw-shaped structures.
Wu Qun Jin Luikui Tang Kai He Xunjun Yang Guohui Fu Jiahui
Dept.of Electronic & Communications Engineering,Harbin Institute of Technology,Harbin 150001,P.R.China
国际会议
2008 China-Japan Joint Microwave Conference(2008年中日微波会议)
上海
英文
640-643
2008-09-10（万方平台首次上网日期，不代表论文的发表时间）