Modeling and realization of a wideband LNA based on LTCC technology
A wideband low noise amplifier integrated into a LTCC (Low Temperature Co-Fired Ceramic) environment is presented in This paper. 500hm microstrip lines are simulated using 3D full-wave simulator,which takes into account the electromagnetic effects caused by top conductors recess. To integrate bare chips into LTCC substrates,an entire passive structure of the LNA in cluding bond wires and via arrays is designed and optimized,with bond wires for interconnection from MMIC chips to microstrip lines and via arrays for grounding between different ground planes. An equivalent π-type model for two-parallel bond wires is analyzed and parameters of the model are extracted. The pitch of via arrays is studied to obtain good grounding performance. To implement an overall simulation of the LNA,EM (electromagnetic)-based data of the full passive structure are exported into ADS and are cascaded with S parameter data of MMIC. The measured results show the LNA hasA 20dB gain,a 7dB return loss andA 2.6riB noise figure from 8 GHz to 20 GHz. Good agreement between simulated and measure results is achieved.
Jianhua Ji Yinqiao Li Jianfeng Fang Yuanehun Fei
Department of Electronic Engineering,School of Information Science and Technology,Beijing Institute East China Institute of photo-electronic,P.O.Box 06,Bengbu,233042,P.R.China
国际会议
2008 International Conference on Microwave and Millimeter Wave Technology(2008国际微波毫米波技术会议)
南京
英文
378-381
2008-04-21（万方平台首次上网日期，不代表论文的发表时间）