Electromagnetic Characterization Analysis of the Connecting Structure of the Via in Multilayered Microwave Circuit

摘要：

Via hole is frequently applied in multilayer micro-wave circuit interconnection. As the discontinuity of via,it causes more reflection and radiation when frequency becomes higher.Therefore,electromagnetic characterization analysis of via is important in the design of microwave circuit. The paper presents the electromagnetic modeling method of via based on the principle of microwave network in multilayer microwave circuit.To achieve the simplification,the authors decompose the overall structure into several substructures,then,Matrix-Penciled Moment Method and microwave network theory are used to analyze each substructure.

作者: Cai Xuanwei Tian Yu Tong Ling

作者单位: College of Automation,UESTC,610054,China

会议类型: 国际会议

会议名称: 2008 Global Symposium on Millimeter Waves(GSMM 2008)(2008全球毫米波学术大会)

会议地点: 南京

会议语种:英文

页码: 275-278

在线出版日期: 2008-04-21（万方平台首次上网日期，不代表论文的发表时间）