Modeling and Characteristic of the Vertical Bonding-Wire Interconnection in Ka-band

摘要：

This paper announced a new type of bonding interconnect-vertical bonding interconnect. Bonding interconnect is the critical technique for realizing the interconnection of microwave chip. The height,distance,number of wires and joint space of bonding interconnect have important effects on its microwave characteristics. In this paper,commercial 3D electromagnetic analysis software HFSS ,microwave circuit design software ADS and Agilent vectornetwork analyzer were used to model,simulate and optimize forthe microwave characteristics of bonding interconnect,andproduce the model,experimental results shown in this paper.

关键词： Vertical bonding wire interconnection Microwave chip stacked die package

作者: Dawei An Xiang Li Jinchao Mou Xin Lv

作者单位: Lab.MCES.Beijing Institute of Technology,District HaiDian,Beijing,100081 Lab.MCES.Beijing Institute of Technology,District HaiDian,Beijing,100081 Institute of Technology,Dis

会议类型: 国际会议

会议名称: 2008 Global Symposium on Millimeter Waves(GSMM 2008)(2008全球毫米波学术大会)

会议地点: 南京

会议语种:英文

页码: 229-232

在线出版日期: 2008-04-21（万方平台首次上网日期，不代表论文的发表时间）