The shear strength of the flip-chip solder bump

摘要：

In this paper,the process of lead free flip chip solder bump is investigated. Some important points in the process of lead free flip chip solder bump are analyzed. The failure mode of solder bump is proved and shear testing has been done. The pure shear force should be applied to the bond. The shear strength of the flip chip solder bump are presented and com pared. Then,it is found that the shear strength of solder bump increases with the reflow times and a ductile deformation occurred in the bulk solder even after multi-reflow.

关键词： Flip chip solder bump Lead free Shear testing Failure mode Ductile deformation

作者: Chunwei Ma Enxia Zhang Peiquan Xu Jianping He

作者单位: School of Materials Engineering,Shanghai Univ.Of Eng Sci.Shanghai 201620,China

会议类型: 国际会议

会议名称: Fracture Mechanics and Applications 2008(国际断裂力学2008年年会)(FM2008)

会议地点: 杭州

会议语种:英文

页码: 443-446

在线出版日期: 2008-10-31（万方平台首次上网日期，不代表论文的发表时间）