THE TEMPERATURE DISTRIBUTION OF HETEROGENEOUS MATERIAL FOR THERMOELECTRIC DEVICES IN SINTERING BY SPS METHOD
The efficiency of a thermoelectric (TE) device is determined by material used as making device,and preparation method of the material is crucial for improving its property.The major feature of spark plasma sintering (SPS) is that lower sintering temperature,shorter processing time,and the grain growth is minimized by high heating rates.But high heating rates and short holding time in sintering process can cause temperature gradient in sample,leading to non-uniform microstructure and reduced mechanical property.Therefore,the temperature and temperature gradient during SPS process should be evaluated and controlled as well as possible.The sample used as TE device consists of semiconductor material CoSb3,electrode material Mo and Ti powder.The temperature distribution and evolution of the punch-die-sample (Mo/Ti/CoSb3) system in SPS process is obtained by finite element method,and the simulation results agree well with the available experimental data,such as the die interior temperature in sintering process measured by thermocouples.It was found that the sample and punch have the highest temperature in the whole process,and the radial temperature gradient in CoSb3 was obvious due to the lower thermal conductivity of CoSb3,an important aspect that distinguishes our study from others is that the effect of thermal conductivity and electrical resistivity of CoSb3 on temperature gradient was given.
thermoelectric material temperature distribution spark plasma sintering finite element method
Y.H.Cai D.G Zhao W.Jiang L.D.Chen P.C.Zhai
State key Laboratory of High Performance Ceramics and Superfine Microstructure,Shanghai Institute of Department of Engineering Structure and Mechanics,Wuhan University of Technology,Wuhan 430070,China
国际会议
第二届国际非均质材料力学会议(The Second International Conference on Heterogeneous Material Mechanics)
安徽黄山
英文
1546
2008-06-03（万方平台首次上网日期，不代表论文的发表时间）