Experimental and Numerical Investigations on Solder Reliability for Flip-Chip BGA Packaging
Solder reliability assessments are performed in this research using a 3-D equivalent global model and local submodeling technique.The equivalent global model is capable of addressing cirtical solder failure locations.The local solder ball and bump submodels are then used to predict number of cycles to failure.Because the solder bumps are encapsulated with underfill material,the fatigue model was derived from the ratio expressed between cases with and without underfill to determine the correlative fatigue ductility coefficient.Two flip-chip BGA package cases are studied with the provided experimental data.According to the prediction fatigue life results,the determined solder ball life is close to the first failure and the determined solder bump life for the second studied case also shows conservative agreement with the field data.
solder reliability flip-chip BGA package fatigue life
Ching-I Chen Cheng-Chung Lee Ching-Yu Ni
Department of Mechanical EngineeringChung-Hua UniversityHsinChu,Chinese Taipei Department of Research Center Xintec Inc.Chung-Li,Chinese Taipei
国际会议
北京
英文
2008-10-12（万方平台首次上网日期，不代表论文的发表时间）