Influence of Magnetic Field on Copper Electrodeposition
In the plating applied to a lot of fields including electronics field and the electrolytic refining such as the copper,the electrolysis technology is used widely.Especially,with the densification of the electronic base correlating to technical advantages and miniaturizations by the electronics device,more precision and quality,certain film formation have been demanded.For a film formation performance enhancement, development of the plating bath and the examination of the plating method have been performed so far.So,We are aiming at the advancement of a film formation performance under the magnetic field. In this experiment,I performed the electrodeposition with the copper sulfate plating bath composed chiefly of a copper sulfate and a sulfuric acid.In the case of no magnetic field,the copper plating became the uneven form very coarsely.However,in the electric copper plating in a magnetic field,the irregularities were upgraded , and the electrodeposition improved.It is thought that this is because the following magnetic field effects worked by plating in the magnetic field.And adding polymers such as Glue or PEG made the crystals more microscopical and made and made the sample surface more flat and smooth,and these effects were strengthened by the magnetic field effect further.
electrodeposition magnetic field polymers crystal cathode potential
Sho Sakurai Toshiyuki Kozuka Masayasu Kawahara
Department of Materials Science and Engineering,Kumamoto University,Japan
国际会议
上海
英文
2008-10-13（万方平台首次上网日期，不代表论文的发表时间）