Performance characteristics of a piezoelectric driven dispenser for semiconductor package
This paper presents a new type of jetting dispenser featuring piezoelectric actuator in order to achieve high flow rate and small dot sizes in semiconductor packaging processes.After describing structural components of the dispensing mechanism and the operating principle,a dynamic modeling is undertaken by considering the behavior of the piezoelectric actuator,hydraulic magnification,dispensing needle and adhesive fluid.In the modeling,fluid models for adhesive fluid and hydraulic magnification are derived with a lumped parameter method.The governing equation of motion is then derived by integrating the fluid models with structural model.Subsequently,the dynamic behavior of the dispenser and its dispensing amount are investigated by applying a sinusoidal driving voltage input.The proposed jetting dispenser is then manufactured and its preliminary test results are demonstrated.Finally,a control system is designed to control the dispensing flow rate of the dispenser.
jetting dispenser piezoelectric actuator hydraulic magnification device lumped-parameter method
Q. H. Nguyen M. K. Choi B. Y. Yun S. B. Choi
Smart Structures and Systems Laboratory,Department of Mechanical Engineering,Inha University,Incheon,Korea
国际会议
The World Forum on Smart Materials and Smart Structures Technology(SMSST07)(2007年世界智能材料与智能结构技术论坛)
重庆·南京
英文
2007-05-01（万方平台首次上网日期，不代表论文的发表时间）