Techniques to characterize the structure of adhesive/dentin interfaces
Wet bonding technique 1 which involves separate acid etching and rinsing steps has led to higher bondstrength by preventing the collapse of demineralized dentin and enhancing the infiltration of adhesive intocollagen networks, as a result of wet bonding, a ca. 7 microns adhesive/dentin (a/d) interface will be formed. Thecontemporary self-etching adhesives/primers were designed to combine both the etching function and theresin-forming function, thus eliminating rinsing steps, at this case, a ca. 3 microns adhesive/dentin interface canbe formed. Compared to total-etch adhesives, self-etching adhesives are generally more user-friendly, lesstechnique sensitive and easer in achieving a hermetic seal. 2,3. The structure of a/d interface plays a veryimportant role in determining the bonding quality. Many techniques have been employed to characterize thestructure of a/d interfaces. Such as SEM, TEM, staining method, SAM and micro-Raman and micro-tensile test.
Xinglin Guo Yong Wang Paulette Spencer Shenguo Wang
State Key Laboratory of Polymer Physics and Chemistry,Beijing State Laboratory of Molecular Science, Department of Oral Biology,University of Missouri-Kansas City School of Dentistry,Kansas City,MO 641 Bioengineering Research Center,School of Engineering,University of Kansas,Lawrence,KS 66045,USA
国际会议
5th East-Asian Polymer Conference(第5届东亚高分子学术研讨会)
上海
英文
56-57
2008-06-03（万方平台首次上网日期，不代表论文的发表时间）