Fracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut technology
Annealing temperature is very critical in the Smart-Cut process especially when material mismatch exists. Experiments have shown that high temperature along with thermal mismatch may fail the Smart-Cut process by inducing severe deformation or cracks on the films. The present paper, following our previous investigations on the Smart-Cut process,studies the effects of temperature and material mismatch on wafer splitting in the Smart-Cut technology by using fracture mechanics analysis. The influence of temperature is explored through its effect on the internal pressure inside the defects and thermal stresses whether the donor wafer and the handle wafer are the same materials or not. Our analysis shows that increasing temperature may promote defect growth by increasing the internal pressure, and that thermal stresses arising from temperature change accompanied by material mismatch may inhibit defect growth and lead to growth deviation. In addition,the results indicate that the elastic mismatch of materials plays a significant role in wafer splitting in the Smart-Cut process even when the thermal stresses vanish.
Smart-Cut technique Fracture mechanics Deflection angle Energy release rate Thermal mismatch
Bin Gu Hong-Yuan Liu Yiu-Wing Mai Xi-Qiao Feng Shou-Wen Yu
Centre for Advanced Materials Technology (CAMT),School of Aerospace.Mechanical and Mechatronic Engin Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China
国际会议
The Eighth International Conference on Fundamentals of Fracture(ICFF VIII)(第八届断裂基础国际会议)
香港·广州
英文
4996-5006
2008-01-03（万方平台首次上网日期，不代表论文的发表时间）