Indentation-induced residual stresses in 45S5 bioglass and the stress effect on the material dissolution

摘要：

Using microindentation technique, localized residual stresses were created in 45S5 bioglass. The indentation-induced residual stresses increased with increasing the indentation load for the same distance to the indent center; and the magnitude of average local residual stress decreased with the increase in the distance to the indent center. The stressesassisted dissolution of the 45S5 bioglass was demonstrated by studying the growth behavior of radial cracks in phosphate buffer solution. A linear relation between the indentation load and the ratio of the change in crack length to the square root of time was established.Which was supported by experimental results.

关键词： Bioactive glass Indentation Residual stress Dissolution

作者: Ding Li Fuqian Yang John Nychka

作者单位: Chemical and Materials Engineering Department,University of Kentucky,Lexington 40506-0046,USA Chemical and Materials Engineering Department,University of Alberta,Edmonton.AB,Canada

会议类型: 国际会议

会议名称: The Eighth International Conference on Fundamentals of Fracture(ICFF VIII)(第八届断裂基础国际会议)

会议地点: 香港·广州

会议语种:英文

页码: 4898-4908

在线出版日期: 2008-01-03（万方平台首次上网日期，不代表论文的发表时间）