Thermosetting Polyimides Derived from 3,3,4,4-Bcnzophenone-Tetracarboxylic Dianhydride and Various Aromatic Diamines for Advanced Microelectronic Packaging
The rapid evolution in microelectronic technology is a well known phenomenon. Aromatic polyimides, due to their excellent thermal, mechanical and electrical properties, play a significant role in achieving the current state-of-the-art in microelectronic packaging. However, one of the big technological challenges that packaging engineers have to deal with is the processing of the polyimides. Therefore, seeking for melt-processable aromatic polyimide material which could be thermally cured at relative low temperature to produce laminate with high thermal and dimensional stability and good thermo-mechanical properties has been a scientific and technological challenge.
Hong-yan Xu Hai-xia Yang Li-ming Tao Jin-gang Liu Lin Fan Shi-yong Yang
Laboratory of Aclvanced Polymer Materials,Institute of Chemistry,Chinese Academy of Sciences,Zhongguancun,Beijing 100190,China
国际会议
5th International Symposium on High-Tech Polymer Materials(HTPM-V)(第五届国际高技术高分子材料学术会议)
北京
英文
198-199
2008-10-27（万方平台首次上网日期，不代表论文的发表时间）