Thermosetting Polyimide Resins with High Temperature and Toughness for High Density Packaging Substrates
Future high density packaging technologies will become higher reliability, better performance and more miniaturization. Following these trends, packaging substrates are required to have higher thermal and dimensional stability, better mechanical properties, better dielectric properties and good processing property.Aromatic polyimides, due to their excellent thermal stability, good dielectric and electrical insulating properties, high thermo-mechanical properties and dimensional stability, as well as low coefficient of thermal expansion (CTE) etc. have extensively applied in microelectronic packaging. PMR-type thermosetting polyimides are regarded as state-of-the-art high thermosetting temperature polymers, because of their excellent thermal and processing properties. However, most of PMR-type polyimides are intrinsically brittle.
Hong-yan Xu Hai-xia Yang Li-ming Tao Jin-gang Liu Lin Fan Shi-yong Yang
Laboratory of Advanced Polymer Materials,Institute of Chemistry,Chinese Academy of Sciences,Zhongguancun,Beijing 100190,China
国际会议
5th International Symposium on High-Tech Polymer Materials(HTPM-V)(第五届国际高技术高分子材料学术会议)
北京
英文
196-197
2008-10-27（万方平台首次上网日期，不代表论文的发表时间）