Thick-film Au-Pt Conductive Paste Used as Soldered Area
By using polyvinyl alcohol as disperse agent, Au and Pt powders were prepared respectively by reduction of chlorauric acid to Au with ascorbic acid and reduction of chloroplatinate to Pt with bydrazine. Average size was 0.55μm for Au and about 0.08μm for Pt powder. One glass-, three mixed bonded pastes with Au/Pt ratio of 78/22 were formulated with oxides and borasilicates as binders. Themeasurement showed that the properties of a better paste were: tensile strength of > 20MPa, shrinkage after firing of ≤0.003mm, sheet resistivity of ≤40mΩ/□/25μm, and leached amount of 0.062 -0.087mm after dipping 30 times. CuO dissolved into the glass improving chemical bond, consequently,increasing the adhesion.
Metal materials Thick-flm microelectronic technology Au-Pt conductor Soldered area Binder
Yu Shougeng Liu Enuo Zhang Xiaoming
Kunming Institute of Precious Metals,Kunming 650221,China
国际会议
第三届国际贵金属会议(The Third International Conference on Precious Metals)
西安
英文
135-139
2008-06-01（万方平台首次上网日期，不代表论文的发表时间）