Preparation of Pt-Ni Alloy PVD Sputtering Material for Semiconductor Application

Precious metal Pt and Pt-based alloys are important thin film materials used in information industry.With the development of semiconductor industry in recent years,there is an increasing demand for Pt in integrate circuit and discrete devices manufacturing.In the present work, Pt-40% Ni and Pt85% Ni (weight percent) two typical compositions of Pt-Ni alloy were prepared. Vacuum induction melting and following thermo-mechanical treatment were investigated to get high purity and high density Pt-Ni sputtering materials with fine grain size.
Pt-Ni alloy High purity Fine grain size Sputtering material
He Jinjiang Bai Geling Wang Xinping Liu Shuqin
GRIKIN Advanced Materials Co.,Ltd.,General Research Institute for Non-ferrous Metals,Beijing 102200,China
国际会议
第三届国际贵金属会议(The Third International Conference on Precious Metals)
西安
英文
99-103
2008-06-01(万方平台首次上网日期,不代表论文的发表时间)