INFLUENCE OF TECHNICAL PARAMETERS ON DEPOSITING RATE OF SMCO FILMS PREPARED BY MAGNETRON SPUTTERING
Thickness is considered one main factor influencing magnetic properties of thin film, and depositing rate is the direct key of film thickness control. Through the orthogonal experimental design SmCo thin films were prepared by DC magnetron sputtering and the influence of technical parameters on depositing rate of SmCo films was investigated by means of mathematical statistics method. And the dependence of magnetic property on SmCo film thickness was also presented. The results reveal that among the technical parameters the sputtering power and the target-substrate distance have significant influence on the depositing rate: with the increase of sputtering power in range of 40W～120W,the depositing rate of SmCo thin film rises accordingly; and as the targetsubstrate distance increasing within range of 50mm～70mm, the depositing rate of SmCo thin film gradually decreases; while Ar pressure works little on the depositing rate of SmCo thin film in range of 0.7Pa～1.5 Pa, as in experiment. Results also show that the depositing rate of SmCo film presents a good uniformity under fixed process condition, as well as that the coercivity of SmCo thin film decreases with the increase of film thickness.
SmCo film Magnetron Sputtering Technical Parameter Depositing Rate
Liu JY Ma SN Li CQ Qiu J
Academy of Armored Forces Engineering, 21 Dujiakan, Beijing, 100072, China. State Key Laboratory for Remanufacturing, 21 Dujiakan, Beijing, 100072, China.
国际会议
北京
英文
1014-1018
2008-10-27（万方平台首次上网日期，不代表论文的发表时间）