ELECTRONIC EQUIPMENT RELIABILITY BASED ON THERMAL FIELD ANALYSIS

摘要：

The reliability of electronic equipment largely depended on the temperature coefficient. For electronic equipment, different temperature leads to different reliability. Through ANSYS software being used in thermal field solution of electronic equipment in operation mode, the temperature of every electronic elements and devices can be got. And then, the reliability of electronic equipment is calculated through reliability model. In this paper, the analysis idea of electronic equipment reliability based on thermal field analysis is given. Aim to the character of ANSYS software, the solution steps for reliability analysis of electronic equipment is studied. At last, an example is also given.

关键词： Reliability Model Thermal Field Electronic Equipment

作者: SHI Xian-ming SHI Quan ZHAO Jian-min HAO Jin-feng

作者单位: Management Department, Shijiazhuang Mechanical Engineering College, Shijiazhuang 050003, P. R. China

会议类型: 国际会议

会议名称: the 3rd World Congress on Engineering Asset Management andIntelligent Maintenance Systems(第三届世界工程资产管理及智能维修学术大会)

会议地点: 北京

会议语种:英文

页码: 1403-1407

在线出版日期: 2008-10-27（万方平台首次上网日期，不代表论文的发表时间）