Thermal performance of lead-free microelectronic BGA package with defects
In this study, the detection and evaluation of defects at Pb-free BGA solder joints (SAC387, 95.5wt%Sn/ 3.8wt%Ag/ 0.7wt%Cu) in Printed Circuit Boards (PCB) placed under different thermal cycle conditions are investigated. By using digital radiography X-ray technique, the soldering defects in the packages including bridges, voids, ball missing, poor wetting, and tilted balls are identified. Subsequently, the thermal mechanical packages subjected to thermal cycling tests is predicted and compared. It shows that various defect will have different influences on the thermal mechanical behaviours and reliability of a BGA package. The decrease in lifetime of defective packages depends on temperature and the defect classification. The experimental results achieved will provide valuable data for further optimization of Pb-free BGA design.
Soldering defect X-ray radiography Moiré interferometry Shear strain Reliability
Haixia SHANG Jianxin GAO P. Ian NICHOLSON Carl FORREST Steve KENNY
TWI Technology Centre (Wales) Ltd, ECM 2, Margam, Port Talbot, SA13 2EZ U.K.
国际会议
第十七届世界无损检测会议(17th World Conference on Nondestructive Testing)
上海
英文
2474-2483
2008-10-25（万方平台首次上网日期，不代表论文的发表时间）