Preparation of Phenolic Molding Compound by Nonmetals of Waste PCBs
The present technologies of treating waste printed circuit boards (PCBs) are concentrating on recycling metals. However, significant quantities of nonmetals in PCBs present a challenge for treating.In this study, two kinds of nonmetals (paper-nonmetals and glass-nonmetals) from different PCBs are used to replace wood flour for producing phenolic molding compound (PMC). Properties including flexural strength, charpy notched impact strength, heat deflection temperature, dielectric strength and rasching fluidity of PMC with nonmetals (PMCN) are compared with traditional PMC. To ensure sufficient properties of PMCN, the optimal added contents for paper-nonmetals and glass-nonmetals are 20 and 40 wt %. All the results indicate that making PMC with nonmetals of waste PCBs can resolve environmental pollution and provide a new method for resource utilization of nonmetals from waste PCBs.
printed circuit boards phenolic molding compound nonmetals utilization
Guo Jie Xu Zhenming
School of Environmental Science and Engineering, Shanghai Jiao Tong University Shanghai 200240, China
国际会议
The 3rd International Conference on Waste Management and Technology(第三届固体废物管理与技术国际研讨会)
北京
英文
292-300
2008-11-05（万方平台首次上网日期，不代表论文的发表时间）