The Effects of Surfactant Concentration on EMI Shielding Effectiveness for the Electroless Copper Sulfide/EVA Nanocomposites
In this study, the copper sulfide compound was synthesized by electroless deposition method with adding various concentrations of surfactant (cetyltrimethylammonium bromide, CTAB). And then, the copper sulfide was compounded with polymeric substrate (Ethylene-Vinyl Acetate, EVA) due to its conductivity of copper sulphide. The conductive filler would interdict the conductive network in the composites for the effect of the electromagnetic shielding. The electroless deposition bath added the cationic surfactant CTAB, the CTAB was capped and absorbed on the copper sulfide in the electroless reaction. Finally, copper sulfide deposited as the electroless deposition added 0.03M CTAB, and the 100 phr copper sulfide/EVA composite possessed the higher EMI SE value exceed to 40 dB after blending. Hence, the copper sulfide had the very well-conducting path to form network in the EVA polymer matrix. And the copper sulfide was prepared by the CTAB concentration at 0.03M. The polymeric composite could make the reactive electromagnetic correspond to reflection the electromagnetic wave.
EMI SE electroless plating copper sulfide blending surfactant CTAB
YenHung Chen ChenJing Yu ChiYuan Huang
Department of Materials Engineering, Tatung University, 104 Taipei, Taiwan
国际会议
The 12th Asian Pacific Confederation of Chemical Engineering Congress(第十二届亚太化工联盟大会暨化工展览会)
大连
英文
2008-08-04（万方平台首次上网日期，不代表论文的发表时间）