The Application of Alkali Nano-sized SiO2 Slurry on Ultra-Precision Machining Process of the Material surface
Aiming at some problems on ultra-precision machining process of the material surface by chemical mechanical polishing （CMP）with acidic slurry, a new technical route has been introduced. That is : the chemistry effect plays the main role and the mechanical effect only plays the roles of mass-transfer, temperature distribution, keeping the consistency of linear velocity .We have effectively solved the technical problem that nano-sized SiO2 hydrosol is apt to coagulation and dissolution in aqueous solution with high PH value and high concentration. A new type of alkali nano-sized SiO2 slurry was developed .It has certain advantages of simplified process and low cost .It is a good solution to many problems which the acidic slurry can not solve. The inventions could be further applied to the planarization of Ф300mm wafer , 65nm feature size or under by the CMP technology.
Nano-Size Alkali slurry Chemical Mechanical Polishing
刘玉岭 武亚红 孙薇
河北工业大学 微电子技术与材料研究所 天津 300130
国际会议
成都
英文
2007-11-19（万方平台首次上网日期，不代表论文的发表时间）