Asynchronous FIFO, Cascade expansion, Simulation waveform.

摘要：

Assembly precision controlling is difficult in the MEMS solder self-assembly technology, which is influenced by solder model development, model reconstruction and thermal distortion and so on. Thermal distortion of microstructure and solder joint is the key factor which affects the assembly precision greatly. Distortion of microstructure and solder joint induced during the process of soldering is discussed through thermal/structure module in ANSYS in this paper, which includes solder profile setting for MEMS self-assembly experiment, load exerting method, and link position and so on. Distortion of microstructure and solder joint and the comparison under the different condition of link position is emphasized, the methods which can bring in less distortion is obtained, which can provide the self-assembly experimental design with the theory foundation.

关键词： Asynchronous FIFO Cascade expansion Simulation waveform.

作者: 潘开林 颜毅林

作者单位: 桂林电子科技大学 机电工程学院 桂林 541004

会议类型: 国际会议

会议名称: 第六届中国国际纳米科技研讨会

会议地点: 成都

会议语种:英文

在线出版日期: 2007-11-19（万方平台首次上网日期，不代表论文的发表时间）