Study on Irrigation & Encapsulation Technology of Electronic Circuit in High Overload Test

摘要：

The irrigation & encapsulation of the test circuit is essential technics in high overload test. Choose better endergonic cushion materials and use appropriate irrigation & encapsulation technics are both effective methods to enhance the reliability of the test circuit under the high impact and vibrating environment. This article discusses the problems which need to be noticed in the irrigation & encapsulation process so as to guarantee the holistic performance and the anti- high overload performance of the irrigation & encapsulation circuit.

作者: Zhai Chengrui

作者单位: Key Laboratory of Instrumentation Science & Dynamic Measurement (North University of China), Ministry of Education Department of Electronic Science and technology, North university of China, Taiyuan, 030051

会议类型: 国际会议

会议名称: 第七届国际测试技术研讨会

会议地点: 北京

会议语种:英文

在线出版日期: 2007-08-05（万方平台首次上网日期，不代表论文的发表时间）