会议专题

Ultrasonic Echo Signal Analysis of Multi-layer Adhesive Bonded Structure Based on Wavelet-packet Transform

In the ultrasonic non-destructive evaluation of multi-layer structure, one problem is that echoes from different interior layers may overlap, causing obscurity or loss of the fault-detection- and-localization information from a particular layer. To address this issue, a wavelet-packet -transform- based approach was adopted to extract features from echoes, which in turn were used to estimate the specimens adhesive properties. The features thus extracted were found effective in analyzing and identifying the adhesive properties of the specimen concerned. This method of feature extraction is expected to be largely applicable to the non- destructive evaluation of multi-layer bonded structure.

multi-layered structure ultrasonic wavelet packet debond

Dun Yi Wang Feng Shi Xiao-hong Xu Zhang-sui

Nondestructive Testing Technology institute, Mechanical Engineering College, Shijiazhuang ,050003,China

国际会议

第七届国际测试技术研讨会

北京

英文

2007-08-05(万方平台首次上网日期,不代表论文的发表时间)