Research on Effect of Soldering Temperature and Time on Intensity of Sn-Ag-Cu (In) Solder without Plumbum
The background and development of Pb-free solder used in electronic products is introduced in this paper. Then the problem is analyzed among the research of solder without Pb (plumbum). In this paper, the intensity experiment of Sn-Ag-Cu (In) without plumbum is reported, which is according to the national standard of Russia ГОСТ 28830-90. The effects of soldering temperature and time on jointing intensity are analyzed in detail. By the processing the result of experiment, a mathematical model of jointing is presented, and the optimal soldering temperature and time are proposed based on the mathematical model.
Pb-free solder intensity Mathematical model
FENG Lei Chetanov,A.N.
Department of Automatic Test and Control, Harbin Institute of Technology, Harbin 150001 Bowman state-run technology university of Moscow
国际会议
北京
英文
2007-08-05（万方平台首次上网日期，不代表论文的发表时间）