Simulation of Piezoresistive Micro Accelerometers Thermal Cycling Response

摘要：

The difference in the substrate thickness between MEMS and micro-electronics applications leads to quite different behavior during thermomechanical loading. In the paper, by ansys, we simulated thermomechanical behavior of piezoresistive micro accelerometers in thermal cycling. The structure deforms in a non-linear manner, displacement and stress gradients compared to microelectronics when the temperature continually increases. The purpose of this simulation is to design functional and reliable multi-layer MEMS structures.

关键词： Thermal cycling Thermomechanical behavior Simulation

作者: ZHU Ping YANG Wei LIU XuDong

作者单位: Key Laboratory of Instrumentation Science & Dynamic Measurement (North University of China), Ministry of Education Department of Electronic Science and technology, North university of China, Taiyuan, 030051

会议类型: 国际会议

会议名称: 第七届国际测试技术研讨会

会议地点: 北京

会议语种:英文

在线出版日期: 2007-08-05（万方平台首次上网日期，不代表论文的发表时间）