Research on A Novel R-θ Wafer-handling Robot

摘要：

In this paper,a novel 3 DOF R-θ wafer-handling robot,which can finish Z (up-down)movement,θ (rotation) movement,and R (radial linear stretching)movement,is presented.The mechanism and function are introduced in detail. With building the kinematics model and dynamics model of radial linear stretching component,the kinematics analysis and dynamics analysis are discussed.Based on MPC02 motion control card,the control system is formed.To meet the high velocity requirement,a time-optimal trajectory planning method with considering the constrained conditions is presented.The application to practical example shows that the proposed method is simple and effective.

关键词： R-Wafer-Handling Robot Kinematics Analy- sis Dynamics Analysis Control System Time-Optimal Trajectory Planning

作者: Ming Cong Xu Yu Baohong Shen Jing Liu

作者单位: Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of Technology Dalian, Liaoning Province, China

会议类型: 国际会议

会议名称: 2007 IEEE International Conference on Automation and Lofistics

会议地点: 山东济南

会议语种:英文

在线出版日期: 2007-08-18（万方平台首次上网日期，不代表论文的发表时间）