AN EXPERIMENTAL STUDY OF TMAH ETCHING SILICON FOR MEMS

摘要：

In the process of Micro-Electrical- Mechanical System (MEMS), the anisotropic wet chemical etching rate of the silicon wafer is very important for fabricating MEMS to determine the fabricating method, processing and etching time . The etching rates of the silicon wafer in the TMAH solution with the different temperature are obtained in this paper. The micro-fabrication technology and micro-fabrication process are also discussed. In the same time, all experimental data are put forward in details.

关键词： TMAH MEMS Silicon Wafer Etch Micro-Fabrication

作者: Feiyan Chen Guoqing Hu Baihai Wu

作者单位: Facuity of Eiectromechanical Engineering,Guangdong University of Technology,Guangzhou,China.;Mechani Facuity of Eiectromechanical Engineering,Guangdong University of Technology,Guangzhou,China.;Dept.of Facuity of Eiectromechanical Engineering,Guangdong University of Technology,Guangzhou,China

会议类型: 国际会议

会议名称: 2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

会议地点: 海南三亚

会议语种:英文

在线出版日期: 2007-01-10（万方平台首次上网日期，不代表论文的发表时间）