DUAL LAYER PHOTORESIST AND BACK SPUTTERING APPLIED IN LIFT-OFF TECHNIQUE

摘要：

Lift-off has been widely used in microfabrication process. In normal lift-off process, after photolithography and developing, a thin layer of residua will remain on the exposed substrate. To remove the residua, descum and back sputtering are required before metal sputtering. However, because of the high temperature of descum process and high energy induced by ion bombardment during back sputtering, the up inner angle of photoresist will increase in normal lift-off process. The metal films will deposit on the sidewall of the photoresist, and adhereto the substrate even after the photoresist removal. In order to overcome these problems, a lift-off process adopting dual layer photoresist is introduced in this paper, and high quality metallic pattern could be made.

关键词： back sputtering dual layer photoresist lift-off

作者: Lu Zhang Le Zhang Ying Wang Zhenchuan Yang Guizhen Yan

作者单位: Institute of Microelectronics, Peking University, Beijing 100871, China; Changchun University of Sc Institute of Microelectronics, Peking University, Beijing 100871, China

会议类型: 国际会议

会议名称: 2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

会议地点: 海南三亚

会议语种:英文

在线出版日期: 2007-01-10（万方平台首次上网日期，不代表论文的发表时间）