A MICROCHANNEL HEAT SINK WITH UNITARY CIRCULAR FLOW AND SHORT DISTANCE HEAT TRANSFER MODE: DESIGN AND ANALYSIS
The simulation of the forced convection heat transfer occurring in a microchannel heat sink with unitary circular flow and short distance heat transfer is presented. The temperature and velocity distributions of the coolant in the microchannels under the different flow rates were performed using the commercial FE software package ANSYS. The lowest flow rate satisfying the maximum operating temperature of the electronic device is 2ml/min with the input heat flux 25W/cm 2 . The temperature difference along flow direction in the lognitudinal channel with the transverse channel arrays is reduced compared with the traditional parallel channel structure. A uniform temperature distributionand high heat transfer efficiency are developed.
Microchannel heat sink numerical simulation heat transfer.
Y. Wang G. F. Ding
National Key Laboratory of Nano/Micro Fabrication Technology,Key Laboratory of Thin Film and microfabrication of Ministry of Education,Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University
国际会议
海南三亚
英文
2007-01-10(万方平台首次上网日期,不代表论文的发表时间)