会议专题

A MICROCHANNEL HEAT SINK WITH UNITARY CIRCULAR FLOW AND SHORT DISTANCE HEAT TRANSFER MODE: DESIGN AND ANALYSIS

The simulation of the forced convection heat transfer occurring in a microchannel heat sink with unitary circular flow and short distance heat transfer is presented. The temperature and velocity distributions of the coolant in the microchannels under the different flow rates were performed using the commercial FE software package ANSYS. The lowest flow rate satisfying the maximum operating temperature of the electronic device is 2ml/min with the input heat flux 25W/cm 2 . The temperature difference along flow direction in the lognitudinal channel with the transverse channel arrays is reduced compared with the traditional parallel channel structure. A uniform temperature distributionand high heat transfer efficiency are developed.

Microchannel heat sink numerical simulation heat transfer.

Y. Wang G. F. Ding

National Key Laboratory of Nano/Micro Fabrication Technology,Key Laboratory of Thin Film and microfabrication of Ministry of Education,Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University

国际会议

2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

海南三亚

英文

2007-01-10(万方平台首次上网日期,不代表论文的发表时间)