MD SIMULATIONS OF NANOPARTICLE THERMAL CONDUCTIVITY AND NANOSCALE THERMAL CONTACT RESISTANCE
The rapid progress and development of the synthesis and processing of materials with structures having nanometer length scales has created a demand for greater scientific understanding of thermal transport in nanoscale devices. Molecular dynamics (MD) simulations are emerging as a powerful tool for studying thermal conductance and phonon scattering in nanoscale objects. A thermal conduction model for spherical nanoparticles was constructed for non-equilibrium molecular dynamic (NEMD) simulations to investigate variations of the nanoparticle thermal conductivity with particle size. The results show that the nanoparticle thermal conductivity is smaller than the bulk value and that of a thin film with a thickness equal to the particle radius for the same boundary conditions. Another thermal conduction model was constructed to investigate the micro thermal contact resistance variations for various contact scenarios. These results show that the thermal contact resistance is a large part of the conduction resistance that decreases with increasing contact area and increases with increasing contact layer thickness.
Heng Xiang Pei-Xue Jiang Qi-Xin Liu
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,Department of Thermal Engineering, Tsinghua University, Beijing 100084, China
国际会议
海南三亚
英文
2007-01-10（万方平台首次上网日期，不代表论文的发表时间）