CUTTING FORCE ANALYSIS TO DETERMINE THE PERFORMANCE OF MICRO END MILLING PROCESS OF SILICON WAFER

摘要：

There is a lack of fundamental understanding of micro-end- milling of silicon wafer, specifically basic understanding of material removal mechanism, cutting forces and machined surface integrity in micro scale machining of silicon. It is necessary to determine the forces generated during the cutting operation due to chip thickness along with tool geometry, tool material properties and workpiece properties because cutting forces will provide vital information for the design, modeling and control of the machining process. In this study, cuttingforce data can be used to determine cutting regime machining of silicon wafer.

作者: Rusnaldy Tae Jo Ko Hee Sool Kim

作者单位: Yeungnam University

会议类型: 国际会议

会议名称: 2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

会议地点: 海南三亚

会议语种:英文

在线出版日期: 2007-01-10（万方平台首次上网日期，不代表论文的发表时间）