A Low Temperature, Non-aggressive Wafer Level Hermetic Package with UV Cured SU8 Bond

摘要：

In this paper, we present a new technique that could realize wafer level 3-D hermetic package in a very low bonding temperature(120°C) for MEMS (Micro–electro-mechanical Systems) devices. Microcavities were etched on a host glass wafer and were bonded with a carrier silicon wafer. MicroChem SU-8 photoresist is used as the intermediate adhesive layer between the host and carrier wafer. The devices were fabricated by self-aligning etching technique and were finally sealed by coating the structures with sputtered aluminum.Helium leak testing is carried out to verify the hermetic characteristics of the package, 99.7％ of the tested devices were qualified. This technology shows a significant improvement of the hermeticity properties of adhesive bonded cavities, making it particularly suitable for applications on gas-tightness with low temperature,non-aggressive demands.

作者: Yexian WU Guanrong TANG Jing CHEN

作者单位: National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics,Peking University, Beijing 100871, China

会议类型: 国际会议

会议名称: 2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

会议地点: 海南三亚

会议语种:英文

在线出版日期: 2007-01-10（万方平台首次上网日期，不代表论文的发表时间）