STUDY AND MEASUREMENT OF MICRO-SCALE BONDING STRENGTH IN VERTICAL DIRECTION

摘要：

A new way to evaluate the strength of micro-scale bonding is developed by using a silicon cantilever beam bonded on the substrate by a small anchor. The central concept is that the bonding area will be fractured when a certain vertical force is loaded on it, and this force can be used as a “standard. This test is easy to be carried out. It also can be used in in-situ bonding quality monitoring in MEMS fabrication. Edge effect, the length of the bonding area partly determines the bonding strength, is found in micro-scale bonding. The coefficients of the edge effect,which determine the bonding strength at the interface of the bonding are, are calculated. Designers can use the equations and the coefficients to design the bonding areas according to the requirement of bonding strength for their devices or the appropriate test structures for the bonding quality in-situ monitoring.

关键词： Micro-scale bonding strength testing structure edge effect in-situ monitoring

作者: Dongning Liu Dacheng Zhang

作者单位: Institute of Microelectronics Peking University Beijing, China P.R. 100086

会议类型: 国际会议

会议名称: 2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

会议地点: 海南三亚

会议语种:英文

在线出版日期: 2007-01-10（万方平台首次上网日期，不代表论文的发表时间）