Effect of tensile stress on microstructure evolution of Al-Cu-Mg-Ag alloys

摘要：

The effect of tensile stress on thermal microstructure evolution of phase in an Al-Cu-Mg-Ag alloy with high Cu/Mg ratio and higher Ag content was investigated by transmission electron microcopy (TEM) .The samples were aged at 200 for 1 亷 h (T6 condition),then thermal exposed at 250 for 100 亷 h with and without a tensile stress (130 MPa),respectively.The results indicate that precipitates uniformly disperse in the matrix as a major precipitate after artificially aging at 200 for 1 亷 h (T6 condition).Exposed at 250 for 100 亷 h without stress, precipitates dissolve dramatically.Whereas,during stress exposure they coarsen unexpectedly rather than dissolve into matrix.It can be deduced that the stress retards the redissolution of phase.

关键词： Al-Cu-Mg-Ag alloy phase thermal exposure tensile stress

作者: ZHOU Jie LIU Zhi-yi LI Yun-tao LIU Yan-bin XIA Qing-kun DUAN Shui-liang

作者单位: School of Materials Science and Engineering,Central South University,Changsha 410083,China

会议类型: 国际会议

会议名称: 2007年国际有色金属大会(International Conference of Nonfereous Materials 2007)(ICNFM)

会议地点: 长沙

会议语种:英文

在线出版日期: 2007-11-28（万方平台首次上网日期，不代表论文的发表时间）