Fabrication and characterization of high dense Mo/Cu composites for electronic packaging applications
For electronic packaging applications，Mo/Cu composites with volume fractions of 55％.67％ Mo were fabricated by the patented squeeze-casting technology.The microstructures and properties of the Mo/Cu composites were investigated.The results show that Mo particles are homogeneous and uniformly,and the Mo-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers,the densifications of the Mo/Cu composites are higher than 99％.The mean linear coefficients of thermal expansion (20.100 ℃) of Mo/Cu composites range from 7.9 to 9.3×10.6/℃ and decrease with increasing volume fraction of Mo.The experimental coefficients of thermal expansion agree well with predicted values based on Kerner’s model.The thermal and electric conductivities of Mo/Cu composites are in range of 220.270 W/(m·℃) and 22.28 MS/m,respectively,and decrease with increasing volume fraction of Mo.The achievement of higher thermal and electric conduction is attributed to the full densities and high purity,which are obtained through the cost-effective squeeze-casting technology processes.
Mo/Cu composites densification thermal expansion coefficient thermal conductivity electric conductivity
CHEN Guo-qin JIANG Long-tao WU Gao-hui ZHU De-zhi XIU Zi-yang
School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China
国际会议
2007年国际有色金属大会(International Conference of Nonfereous Materials 2007)(ICNFM)
长沙
英文
2007-11-28（万方平台首次上网日期，不代表论文的发表时间）