Preparation for intermetallic powders of Cu-Sn and Cu-Ni-Sn systems via solid-liquid reaction milling technique

摘要：

The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique.The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different intervals.Two kinds of binary intermetallics were obtained.For 12 h,Cu6Sn5 was prepared by milling Sn melt at 573 K while Cu3Sn by milling Sn melt at 773 K.And a mixture of Cu6Sn5 and Cu3Sn was fabricated at 673 K.All these intermetallic powders had mean grain sizes of less than 100 nm.A finer microstructure was obtained by milling Sn melt blended with 20％(mass fraction) Ni powders at 573 K for 12 h.The reaction mechanism and advantages were discussed in comparison with that of high-energy ball milling.The results show the solutionizing of Ni powders in the Cu6Sn5 intermetallic.

关键词： Cu-Sn binary alloy intermetallics powder solid-liquid reaction milling mechanochemical effect

作者: CHEN Ding WU Wei CHEN Zhen-hua FU Ding-fa CHEN Gang

作者单位: School of Materials Science and Engineering,Hunan University,Changsha 410082,China

会议类型: 国际会议

会议名称: 2007年国际有色金属大会(International Conference of Nonfereous Materials 2007)(ICNFM)

会议地点: 长沙

会议语种:英文

在线出版日期: 2007-11-28（万方平台首次上网日期，不代表论文的发表时间）