Development of copper coatings on molybdenum powders by electroless plating technique
Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique.The effect of the solution composition and plating conditions on the electroless copper plating was studied.The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD.The results indicate that the Mo powders are coated with copper,at the same time,Mo-Cu composite powders with Cu content ranging from 15％ to 85％ (mass fraction) can be obtained.The optimal values of pH,HCHO concentration and temperature are in the ranges of 1213,2226 ml/L and 6065 ,respectively.The diffusion ℃ -shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface.
Mo-Cu electroless plating copper powders growth mechanism
WANG Guang-jun WANG De-zhi
Schools of Materials Science and Engineering,Central South University,Changsha 410083,China
国际会议
2007年国际有色金属大会(International Conference of Nonfereous Materials 2007)(ICNFM)
长沙
英文
2007-11-28（万方平台首次上网日期，不代表论文的发表时间）