Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging
(0) In order to improve the thermal properties of MMCs for electronic packaging,the concept of fabrication MMCs with particular interpenetrating phases(IPCs) was proposed.Based on the diffusion theory of reinforcement element in matrix alloys of some particular PMMCs,a novel fabrication method to produce IPCs was proposed.The Si/Al composites (65％Si,volume fraction) with interpenetrating phases were fabricated successfully by squeeze casting and hot press sintering technology.Microstructure observations indicate that the reinforcements Si are of three-dimensional continuous network and the composites are compact without obvious defects.The average linear thermal expansion coefficient (CTE) between 20 ℃ and 100 ℃ of the Si/Al IPCs is 8.27×10.6/K,and the thermal conductivity(TC) is 124.03 W/(m·K),and the composites can meet the demands of electronic packaging.ROM model and Turner model can be used to predict the CTEs of IPCs,and the experimental CTEs are between their theoretical and calculated values.
fabrication method interpenetrating phase composites Si/Al alloy electronic packaging
WANG Xiao-feng WU Gao-hui WANG Ri-chu XIU Zi-yang YU Kun
School of Materials Science and Engineering,Central South University,Changsha 410083,China;School of School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China School of Materials Science and Engineering,Central South University,Changsha 410083,China
国际会议
2007年国际有色金属大会(International Conference of Nonfereous Materials 2007)(ICNFM)
长沙
英文
2007-11-28（万方平台首次上网日期，不代表论文的发表时间）