Mutual Thermal Effects of Light-Emitting Diode with Wafer-Level Packages

摘要：

Wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process with Si-MEMS technology. In this paper, thermal characteristics of wafer-level packaged LEDs with four multi-chips are investigated including mutual thermal effects due to the adjacent chips using both serial and parallel measurement methods.

作者: Jae-Wan Choi Jeung-Mo Kang Jae-Wook Kim Jeong-Hyeon Choi Du-Hyun Kim Geun-Ho Kim Jeong-Soo Lee

作者单位: LED R&D Lab., LG Electronics Institute of Technology, Seoul 137-724, Korea

会议类型: 国际会议

会议名称: 2007年亚洲光纤通讯与光电博览会及研讨会(Asla Optical Fiber Communication & Optoelectronic Exposition & Conference)

会议地点: 上海

会议语种:英文

在线出版日期: 2007-10-17（万方平台首次上网日期，不代表论文的发表时间）