Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength
The adhesion between diamond grits and the bond strongly influence the properties of diamond tools. Since diamond is covalent crystal, the high interfacial energy leads to the poor interface bonding between diamond grits and the bond. Furthermore, the sintering temperature of traditional vitrified bond is also very high because of the high refractoriness of alkalis containing in the bond, resulting in serious thermal damage to diamond grits. In this paper, a low melting point and high strength vitrified bond has been prepared mainly from borate glass, clay and lead glass. The bond is completely glassy above 850℃ and the bending strength of the bond sintered at 850℃ for 7minutes is 125.TMPa with a 6.5:3.5 corundum/bond ratio. Moreover, this bond possesses good wettability with diamond abrasive from 600℃ to 850℃.
Diamond tools Vitrified bond Low melting point and high strength Wettability
Jianbing Zang Jing Lu Yanhui Wang Xianghong Zhang Yungang Yuan
State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao
国际会议
第14届全国磨粒技术学术会议(14th Conference of Abrasive Technology in China)
南京
英文
11-14
2007-10-26（万方平台首次上网日期，不代表论文的发表时间）